ọja-ini
ORISI
ṢÀpèjúwe
ẹka
Idapọpọ Circuit (IC)
Ifibọ – Eto lori Chip (SoC)
olupese
AMD Xilinx
jara
Zynq®-7000
Package
atẹ
ọja ipo
o wa
Faaji
MCU, FPGA
mojuto ero isise
Meji ARM® Cortex®-A9 MPCore™ pẹlu CoreSight™
Filasi iwọn
-
Ramu iwọn
256KB
Awọn agbeegbe
DMA
Asopọmọra
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
iyara
667MHz
akọkọ ro pe
Artix™-7 FPGA, awọn sẹẹli kannaa 28K
otutu iṣẹ
-40°C ~ 100°C (TJ)
Package / apade
225-LFBGA, CSPBGA
Iṣakojọpọ Ẹrọ Olupese
225-CSPBGA (13× 13)
Iwọn I/O
86
Nọmba ọja ipilẹ
XC7Z010
Iwe ati Media
ORIṢẸRẸ
ỌNA ASOPỌ
Awọn pato
Zynq-7000 SoC Specification
Zynq-7000 Gbogbo Eto SoC Akopọ
Zynq-7000 olumulo Itọsọna
Ọja ikẹkọ modulu
Powering Series 7 Xilinx FPGAs pẹlu TI Power Management Solusan
Alaye ayika
Xilinx REACH211 Iwe-ẹri
Iwe-ẹri Xiliinx RoHS
Ifihan Awọn ọja
Gbogbo Zynq®-7000 SoC siseto
TE0723 ArduZynq Series pẹlu Xilinx Zynq®-Z-7010/Z-7007S SoCs
HTML pato
Zynq-7000 Gbogbo Eto SoC Akopọ
Zynq-7000 SoC Specification
Zynq-7000 olumulo Itọsọna
EDA / CAD awoṣe
XC7Z010-1CLG225I nipasẹ SnapEDA
Ayika ati Okeere Classification
ÀWỌN ànímọ́
ṢÀpèjúwe
Ipo RoHS
Ni ibamu pẹlu ROHS3 sipesifikesonu
Ipele Ifamọ Ọrinrin (MSL)
3 (wakati 168)
Ipo REACH
Awọn ọja ti kii ṣe de ọdọ
ECCN
3A991A2
HTSUS
8542.39.0001
