ọja-ini
ORISI
ṢÀpèjúwe
ẹka
Idapọpọ Circuit (IC)
Ifibọ – Eto lori Chip (SoC)
olupese
AMD Xilinx
jara
Zynq®-7000
Package
atẹ
Ipo ọja
o wa
Faaji
MCU, FPGA
mojuto ero isise
Meji ARM® Cortex®-A9 MPCore™ pẹlu CoreSight™
Filasi iwọn
-
Ramu iwọn
256KB
Awọn agbeegbe
DMA
Asopọmọra
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
iyara
800MHz
akọkọ ro pe
Kintex™-7 FPGA, 350K awọn sẹẹli kannaa
Awọn iwọn otutu ti nṣiṣẹ
-40°C ~ 100°C (TJ)
Package / apade
676-BBGA, FCBGA
Iṣakojọpọ Ẹrọ Olupese
676-FCBGA (27×27)
Iwọn I/O
130
Nọmba ọja ipilẹ
XC7Z045
Media ati awọn gbigba lati ayelujara
ORIṢẸRẸ
ỌNA ASOPỌ
Awọn pato
Zynq-7000 Gbogbo Eto SoC Akopọ
XC7Z030,35,45,100 Data iwe
Zynq-7000 olumulo Itọsọna
Ọja ikẹkọ modulu
Powering Series 7 Xilinx FPGAs pẹlu TI Power Management Solusan
Alaye ayika
Iwe-ẹri Xiliinx RoHS
Xilinx REACH211 Iwe-ẹri
Ifihan Awọn ọja
Gbogbo Zynq®-7000 SoC siseto
PCN Design / sipesifikesonu
Ọja Siṣamisi Chg 31/Oct/2016
Ohun elo Mult Dev Chg 16/Dec/2019
PCN package
Awọn ẹrọ pupọ 26/Jun/2017
Errata
Zynq-7000 Errata
Ayika ati Okeere Classification
ÀWỌN ànímọ́
ṢÀpèjúwe
Ipo RoHS
Ni ibamu pẹlu ROHS3 sipesifikesonu
Ipele Ifamọ Ọrinrin (MSL)
3 (wakati 168)
Ipo REACH
Awọn ọja ti kii ṣe de ọdọ
ECCN
3A991D
HTSUS
8542.39.0001
