ọja-ini
ORISI
ṢÀpèjúwe
ẹka
Idapọpọ Circuit (IC)
Ifibọ – Eto lori Chip (SoC)
olupese
AMD Xilinx
jara
Zynq® UltraScale+™ MPSoC CG
Package
atẹ
Ipo ọja
o wa
Faaji
MCU, FPGA
mojuto ero isise
Meji Core ARM® Cortex®-A53 MPCore™ pẹlu CoreSight™, Meji Core ARM® Cortex™-R5 pẹlu CoreSight™
Filasi iwọn
-
Ramu iwọn
256KB
Awọn agbeegbe
DMA, WDT
Asopọmọra
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
iyara
533MHz, 1.3GHz
akọkọ ro pe
Zynq® UltraScale+™ FPGA, 103K+ awọn sẹẹli kannaa
otutu iṣẹ
-40°C ~ 100°C (TJ)
Package / apade
784-BFBGA, FCBGA
Iṣakojọpọ Ẹrọ Olupese
784-FCBGA (23× 23)
Iwọn I/O
252
Nọmba ọja ipilẹ
XCZU2
Media ati awọn gbigba lati ayelujara
ORIṢẸRẸ
ỌNA ASOPỌ
Awọn pato
Zynq UltraScale + MPSoC Akopọ
Alaye ayika
Iwe-ẹri Xiliinx RoHS
Xilinx REACH211 Iwe-ẹri
EDA / CAD awoṣe
XCZU2CG-2SFVC784I nipasẹ SnapEDA
Ayika ati Okeere Classification
ÀWỌN ànímọ́
ṢÀpèjúwe
Ipo RoHS
Ni ibamu pẹlu ROHS3 sipesifikesonu
Ipele Ifamọ Ọrinrin (MSL)
4 (wakati 72)
Ipo REACH
Awọn ọja ti kii ṣe de ọdọ
ECCN
5A002A4 XIL
HTSUS
8542.39.0001
